RF-MEMS wafer-level packaging using through-wafer interconnect

Journal article (2007)

Authors

J. Tian Old - EWI Ch. Integrated Sensing Devices
S Sosin Old - EWI Ch. Integrated Sensing Devices
J Iannacci Old - EWI Ch. Integrated Sensing Devices
R Gaddi External organisation
M. Bartek Old - EWI Ch. Integrated Sensing Devices
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Published Date

2007

Language

Undefined/Unknown

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Research Group

Old - EWI Ch. Integrated Sensing Devices