Flexible interconnects for deformable ultra-thin substrates

Zoumpoulidis, T.; WANG, L; Bartek, M.; Jansen, K.M.B.; Poliakov, A; Sosin, S; Ernst, L.J.; Dekker, R.; Burghartz, JN

Flexible interconnects for deformable ultra-thin substrates

Conference paper (2006)

Authors

T. Zoumpoulidis Old - EWI Ch. Integrated Sensing Devices

L WANG Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering

M. Bartek Old - EWI Ch. Integrated Sensing Devices

K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering

A Poliakov Old - EWI Ch. Integrated Sensing Devices

S Sosin Old - EWI Ch. Integrated Sensing Devices

L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering

R. Dekker External organisation

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2006

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Research Group

Old - EWI Ch. Integrated Sensing Devices