Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid-state lighting technology. The interest in solder joint reliability has increased by the introduction of the so-called high brightness leadless type of packages. Solder joint reliability is one of the main failure modes in these package types, especially when it comes down to lifetimes beyond 20,000 h. Many end customers require lifetime prediction data with respect to board-level reliability. As it is time consuming to determine the endurance performance of each package separately, we have to look for means to reduce test time. A possible method is to actually determine the lifetime of a few products within one product family, and use the obtained results to verify and improve advanced simulation-based prediction models. The improved models will subsequently be used to predict the reliability performance of the entire product family in question. A new and innovative approach to accurately predict the board-level performance of LED packages is proposed.@en

Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the interface of wire and bond pad. This paper will present the finite element analysis of the copper wire bond process and IMC forming and results in the stress pattern shift during the processes. Keywords: Cu wire bond, IC BE structure (BEOL), epoxy curing, IMC grow@en

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.@en