Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Journal article (2011)

Authors

C.A. Yuan Electronic Components, Technology and Materials - , TNO

R Kregting TNO

W.D. van Driel Electronic Components, Technology and Materials -

S Gielen TNO

A. Xiao NXP Semiconductors

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

RF power packages Ceramic package Plastic high power packages Thermal and mechanical modeling Aluminum wires

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http://resolver.tudelft.nl/uuid:4821769a-594a-40c3-904c-9cfaea198934

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Published Date

2011

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.