JJ
Jing Jiang
12 records found
1
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numer
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Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductanc
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Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence
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SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the
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Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-se
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On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to so
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High electric-field stress is an effective solution to the recovery of irradiated devices. In this paper, the dependence of the recovery level on the magnitude of gate voltage and duration is investigated. Compared with the scheme of high gate-bias voltage with a short stress tim
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Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles
A molecular dynamics study
Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect
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Knowledge base question answering (KBQA) aims to answer a question over a knowledge base (KB). Early studies mainly focused on answering simple questions over KBs and achieved great success. However, their performances on complex questions are still far from satisfactory. Therefo
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A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET
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For the relevant properties of pristine and doped (Si, P, Se, Te, As) monolayer WS2 before and after the adsorption of CO, CO2, N2, NO, NO2 and O2, density functional theory (DFT) calculations are made. Calculation results re
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Power devices are developing for the small volume, high performance and modularization. With more and more application scenarios of Brushless Direct Current Motor (BLDC), MOSFET multi-chip module (MCM) is popular with people. However, the conventional wire Bonding and Copper clip
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