RR
RTH Rongen
10 records found
1
We present a time-dependent numerical model for corrosion in microelectronics, focusing on aluminum bondpads, which can be very beneficial for the design as well as the interpretation of reliability data of microelectronics. The model includes charge transport through the polymer
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Plastic encapsulations will absorb moisture in humid environments due to their hydrophilic nature, this in combination with the inherent ionic contamination of the plastic will result in an electrolyte. This electrolyte might pose several reliability issues for the package and th
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Despite extensive research over the past decades, corrosion of aluminum bond pads is still a major reliability risk for plastic encapsulated microelectronics. Nowadays even an increase in susceptibility for corrosion is observed for new waferfab technologies and encapsulation mat
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The supply current of plastic encapsulated microelectronic devices in the presence of a high potential source can increase abnormally due to parasitic gate leakage. According to reliability qualification standards, stress during a parasitic gate leakage test is applied by a coron
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We present a numerical method to describe the transport of ions through polymeric electrolytes under the influence of an applied electrostatic field. The transport of ions results in an ion concentration profile with a large gradient near charged interfaces, the so-called diffuse
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