QY Li | TU Delft Repository

QL

QY Li

Conference paper (2)

Journal article (1)

3 records found

1

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

Journal article (2004) - DG Yang (author), JS Liang (author), QY Li (author), L.J. Ernst (author), GQ Zhang (author)

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

Conference paper (2003) - JS Liang (author), D Yang (author), QY Li (author), L.J. Ernst (author), GQ Zhang (author)

Warpage-based optimization of the curing profile for electronic packaging polymers

Conference paper (2003) - DG Yang (author), K.M.B. Jansen (author), QY Li (author), JS Liang (author), L.J. Ernst (author), GQ Zhang (author)