Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness, and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success without innovation and breakthroughs in the way that we address reliability through the whole value chain. The aim of reliability is to predict, optimize, and design upfront the reliability of micro/nanoelectronics and systems, an area denoted as “Design for Reliability (DfR)”. While virtual schemes based on numerical simulation are widely used for functional design, they lack a systematic approach when used for reliability assessments. Besides this, lifetime predictions are still based on old standards assuming a constant failure rate behavior. In this chapter, we will present the reliability and failures found in solid-state lighting systems. It includes both degradation and catastrophic failure modes from observation toward a full description of its mechanism obtained by extensive use of acceleration tests using knowledge-based qualification methods.@en

The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile behavior and creep behavior of the SnBiAgCu solder alloys were studied at three temperatures (25, 75, 125). Results show that this type of solder alloys presented higher tensile strength and creep deformation endurance than conventional SAC305 solder alloys. Second, a dynamic mechanical analysis was performed to get the storage modulus and glass transition temperature of three types of potting compounds, which were used in the thermal-fatigue simulation. Third, the experimentally determined material data was used for the averaged strain energy density increment calculated by the finite element method. This simulation approach was selected as damage metrics to evaluate solder interconnect reliability under different combinations of materials. It is found that the application of potting compounds will increase strain energy density significantly when compared with the strain energy density calculated without potting compound, which means that potting compounds will deteriorate the thermal-fatigue reliability of solder interconnects. These accurate data-driven simulation models can in the future form the basis for compact digital twins for predicting useful remaining lifetime.

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Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness, and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success without innovation and breakthroughs in the way that we address reliability through the whole value chain. The aim of reliability is to predict, optimize and design upfront the reliability of micro/nanoelectronics and systems, an area denoted as ‘Design for Reliability (DfR)’. While virtual schemes based on numerical simulation are widely used for functional design, they lack a systematic approach when used for reliability assessments. Besides this, lifetime predictions are still based on old standards assuming a constant failure rate behavior. In this paper, we will present the reliability and failures found in solid-state lighting systems. It includes both degradation and catastrophic failure modes from observation towards a full description of its mechanism obtained by extensive use of acceleration tests using knowledge-based qualification methods. A use case will be presented in more details.

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Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness, and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success with-out innovation and breakthroughs in the way that we address reliability through the whole value chain. The aim of reliability is to predict, optimize and design upfront the reliability of micro/nanoelectronics and systems, an area denoted as 'Design for Reliability (DfR)'. While virtual schemes based on numerical simulation are widely used for functional design, they lack a systematic approach when used for reliability assessments. Besides this, lifetime predictions are still based on old standards assuming a constant failure rate behavior. In this paper, we will present the reliability and failures found in solid-state lighting systems. It includes both degradation and catastrophic failure modes from observation towards a full description of its mechanism obtained by extensive use of acceleration tests using knowledge-based qualification methods.

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Reliability of electronic drivers, or systems, is crucial for the business of Signify. We manufacture and sell more than a million drivers per year. Field returns taught us what failure modes are important, but this is not sufficient to provide lifetime claims for our products. Being in this business for almost a century, in order to provide detailed lifetime claims, we have established an internal reliability tool. This tool provides our designers the correct information for flawless driver development. The specially developed Electronics Reliability Tool (ERT) uses on the one hand FIT tables provided by handbooks like e.g., Telcordia and on the other hand also considers wear-out mechanisms due to e.g., lightning strikes. Validation and verification of our predictions is performed by collecting sold quantities, field returns, do extensive failure analysis and compare these values with calculated ones. Each internally designed driver is subjected to an ERT calculation. The forecasted lifetime is used as a yard stick to witness the drivers' targeted lifetime. In our presentation we will demonstrate the tool. In this paper, we describe details of how ERT calculates failure rates. We will also present the comparison between field performance and calculated values of our electronic drivers.

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