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Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013) - J. Tang, CH Chen, SK Liang, EGJ Reinders, CTA Revenberg, JBJ Schelen, C.I.M. Beenakker

Journal article (2011) - O Gutfleisch, MA Willard, E.H. Brück, CH Chen, SG Sankar, J Ping Liu

Journal article (2010) - HA Kirisli, M Schaap, T van Walsum, W.J. Niessen, S Klein, SL Papadopoulou, ML Bonardi, CH Chen, AC Weustink, NRA Mollet, E.P.A. Vonken, R.J. van der Geest

Journal article (2004) - CH Chen, J. Schoonman

Conference paper (2003) - CH Chen, JF Nunamaker, NC Romano, RO Briggs

Journal article (2000) - H Huang, CH Chen, RC Perego, E.M. Kelder, L Chen, J. Schoonman, WJ Weydanz, DW Nielsen

Journal article (1999) - CH Chen, E.M. Kelder, J. Schoonman

Journal article (1999) - CH Chen, MHJ Emond, E.M. Kelder, B Meester, J. Schoonman

Conference paper (1999) - CH Chen, J. Schoonman, Y Kamlag, I Colbeck