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Conference paper (1)

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1

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013) - J. Tang (author) , CH Chen (author) , SK Liang (author) , EGJ Reinders (author) , CTA Revenberg (author) , JBJ Schelen (author) , C. W J Beenakker (author)