CTA Revenberg | TU Delft Repository

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CTA Revenberg

Conference paper (3)

3 records found

1

Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

Conference paper (2015) - J. Tang (author), MR Curiel (author), SL Furcone (author), EGJ Reinders (author), CTA Revenberg (author), C.I.M. Beenakker (author)

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013) - J. Tang (author), CH Chen (author), SK Liang (author), EGJ Reinders (author), CTA Revenberg (author), JBJ Schelen (author), C.I.M. Beenakker (author)

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Conference paper (2012) - J. Tang (author), EGJ Reinders (author), CTA Revenberg (author), JBJ Schelen (author), C.I.M. Beenakker (author)