CTA Revenberg | TU Delft Repository

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CTA Revenberg

Conference paper (3)

3 records found

1

Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

Conference paper (2015) - J. G. Tang (author) , MR Curiel (author) , SL Furcone (author) , EGJ Reinders (author) , CTA Revenberg (author) , C. W J Beenakker (author)

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013) - J. Tang (author) , CH Chen (author) , SK Liang (author) , EGJ Reinders (author) , CTA Revenberg (author) , JBJ Schelen (author) , C. W J Beenakker (author)

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Conference paper (2012) - J. Tang (author) , EGJ Reinders (author) , CTA Revenberg (author) , JBJ Schelen (author) , C.I.M. Beenakker (author)