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MR Curiel
Academic Work (1)
Conference paper (1)
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Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
Conference paper (2015) -
J. Tang (author)
,
MR Curiel (author)
,
SL Furcone (author)
,
EGJ Reinders (author)
,
CTA Revenberg (author)
,
C.I.M. Beenakker (author)
