Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013)

Authors

J. Tang Electronic Components, Technology and Materials
CH Chen External organisation
SK Liang External organisation
EGJ Reinders External organisation
CTA Revenberg External organisation
JBJ Schelen External organisation
C. W J Beenakker Electrical Engineering, Mathematics and Computer Science
Research Group
Electronic Components, Technology and Materials
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Published Date

2013

Language

English

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Research Group

Electronic Components, Technology and Materials

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