ES

Edsger C.P. Smits

8 records found

This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quan ...
Abstract-Prognostic monitoring of Power QFN packages with four distinct silver pastes, each varying in material composition (pure-Ag and resin-reinforced hybrid-Ag) and sintering processes (pressure-assisted and pressureless), was investigated in this study. The PQFN packages wit ...
Silver sintering offers a promising landscape for Pb-free die attachment in electronics packaging. However, the sintered interface properties are highly process-dependent and deviate from bulk silver properties. Conventional measurement methods do not adequately capture the die-a ...
The increasing awareness of environmental concerns and sustainability underlines the importance of energy-efficient systems, renewable energy technologies, electric vehicles, and smart grids. Hence, stringent constraints and safety regulations have been prompted to meet reliabili ...
Resin-reinforced Ag sintering materials represent a promising solution for die-attach applications in high-power devices requiring enhanced reliability and heat dissipation. However, the presence of resin and intricate microstructure poses challenges to its thermal performance, a ...
This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varie ...
Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spre ...
Surfaces which can accurately distinguish spatial and temporal changes in temperature are critical for not only flow sensors, microbolometers, process control, but also future applications like electronic skins and soft robotics. Realizing such surfaces requires the deposition of ...