An Outlook on Power Electronics Reliability and Reliability Monitoring

Book chapter (2024)

Authors

H.A. Martin Electronic Components, Technology and Materials - EEMCS , Chip Integration Technology Center (CITC)
Edsger C.P. Smits Chip Integration Technology Center (CITC)
R.H. Poelma Nexperia B.V., Electronic Components, Technology and Materials - EEMCS
Williem van Driel Signify, Electronic Components, Technology and Materials - EEMCS
Guogi Zhng Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2024

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

The increasing awareness of environmental concerns and sustainability underlines the importance of energy-efficient systems, renewable energy technologies, electric vehicles, and smart grids. Hence, stringent constraints and safety regulations have been prompted to meet reliability standards in power electronics. This chapter provides a comprehensive outlook on the current state of power semiconductor devices, field-critical applications, dominant degradation mechanism (chip-related and package-related), and the emerging measurement techniques for reliability/condition monitoring. This chapter delves into the underlying physics behind each reliability measurement method reviewed. A comparative summary of cost, complexity, online monitoring capability, accuracy, and intrusiveness is provided to enable readers to make informed decisions about the measurement methods. This chapter emphasizes the significance of early fault detection through online monitoring, as it can effectively reduce system downtime for seamless non-interruptive operation.

Files

978-3-031-59361-1_10.pdf
(pdf | 2.05 Mb)
- Embargo expired in 16-12-2024
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