Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias

Conference paper (2009)

Authors

M Saadaoui Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

HTM Pham Old - EWI Sect. ECTM

HC MKnoops External organisation

W. M.M. Kessels External organisation

MCM van de Sanden External organisation

F Roozeboom External organisation

Y Lamy External organisation

KB Jinesh Electronic Components, Technology and Materials -

W. Besling External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2009

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials