Health Monitoring Fatigue Properties of Solder Interconnects in LED Drivers

Book chapter (2024)

Authors

L. Du Electronic Components, Technology and Materials - EEMCS
X. Zhao Signify
René H. Poelma Nexperia B.V.
W.D. van Driel Electronic Components, Technology and Materials - EEMCS , Nexperia
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2024

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Solder fatigue is a key failure mode in the electronic industry. Monitoring the actual degradation of the solder under real-time conditions in any application would be extremely beneficial. In this chapter, we describe the combination of experimental material characterization with numerical finite element (FE) simulations to obtain a prognostics and health monitoring (PHM) methodology for LED drivers used in outdoor lighting applications. Experimental characterization of a new type of solder is described. A FE model is created of a typical component in electronic drivers. The calculated damage level and the collected life data correlate together and form a model for predicting the lifetime of the drivers at certain user condition. The developed PHM methodology helps in identifying and reporting the failure of the driver in real time or can be used for predicting the actual remaining useful life (RUL).

Files

978-3-031-59361-1_13.pdf
(pdf | 1.1 Mb)
- Embargo expired in 16-12-2024
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