Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Journal article (2004)

Authors

D Yang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
L WANG Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
HJL Bressers External organisation
X Fan External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2004

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems