Continuous deep reactive ion etching of tapered via holes for three-dimensional integration

Journal article (2008)

Authors

R Li Old - EWI Sect. ECTM
Y Lamy External organisation
WFA Besling External organisation
F Roozeboom External organisation
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Old - EWI Sect. ECTM
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Published Date

2008

Language

Undefined/Unknown

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Research Group

Old - EWI Sect. ECTM