PH

P Hochstenbach

2 records found

Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)
Book chapter (2008) - F. L. Sun (author), P Hochstenbach (author), Williem van Driel (author), Williem van Driel (author), Williem Driel (author), Williem Driel (author), Williem Van Driel (author), Williem Van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), Willem Dirk Van Driel (author), W. van Driel (author), W. van Driel (author), W. Driel (author), W. Driel (author), W. Van Driel (author), W. Van Driel (author), W. D. van Driel (author), W. D. van Driel (author), W. D. Driel (author), W. D. Driel (author), W. D. Van Driel (author), W. D. Van Driel (author), W.D. van van Driel (author), W.D. van van Driel (author), W.D. van Driel (author), W.D. van Driel (author), W.D. van Van Driel (author), W.D. van Van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), Willem Dirk Van Driel (author), Willem D.Van van Driel (author), Willem D.Van van Driel (author), Willem D.Van Driel (author), Willem D.Van Driel (author), Willem D.Van Van Driel (author), Willem D.Van Van Driel (author), Willem D. van Driel (author), Willem D. van Driel (author), Willem D. Driel (author), Willem D. Driel (author), Willem D. Van Driel (author), Willem D. Van Driel (author), W.D. van Driel (author), W.D. van Driel (author), W.D. Driel (author), W.D. Driel (author), W.D. Van Driel (author), W.D. Van Driel (author), Willem Dirk van van Driel (author), Willem Dirk van van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Van Driel (author), Willem Dirk van Van Driel (author), Willem van Driel (author), Willem van Driel (author), Willem Driel (author), Willem Driel (author), Willem Van Driel (author), Willem Van Driel (author), WD van Driel (author), WD van Driel (author), WD Driel (author), WD Driel (author), WD Van Driel (author), WD Van Driel (author), W. D. van van Driel (author), W. D. van van Driel (author), W. D. van Driel (author), W. D. van Driel (author), W. D. van Van Driel (author), W. D. van Van Driel (author), Guo Qi Zhang (author), Guo Qi Zhang (author), Guo Qi Zhng (author), Guo Qi Zhng (author), Guo Qi Qi Zhang (author), Guo Qi Qi Zhang (author), Guo Qi Z Zhang (author), Guo Qi Z Zhang (author), Guo Qi Z Zhng (author), Guo Qi Z Zhng (author), Guo Qi Z Qi Zhang (author), Guo Qi Z Qi Zhang (author), Kouchi Zhang (author), Kouchi Zhang (author), Kouchi Zhng (author), Kouchi Zhng (author), Kouchi Qi Zhang (author), Kouchi Qi Zhang (author), Gouqi Zhang (author), Gouqi Zhang (author), Gouqi Zhng (author), Gouqi Zhng (author), Gouqi Qi Zhang (author), Gouqi Qi Zhang (author), Guo Zhang (author), Guo Zhang (author), Guo Zhng (author), Guo Zhng (author), Guo Qi Zhang (author), Guo Qi Zhang (author), Guoqi Zhang (author), Guoqi Zhang (author), Guoqi Zhng (author), Guoqi Zhng (author), Guoqi Qi Zhang (author), Guoqi Qi Zhang (author), G.Q Zhang (author), G.Q Zhang (author), G.Q Zhng (author), G.Q Zhng (author), G.Q Qi Zhang (author), G.Q Qi Zhang (author), Guoqi Zhang (author), Guoqi Zhang (author), Guoqi Zhng (author), Guoqi Zhng (author), Guoqi Qi Zhang (author), Guoqi Qi Zhang (author), G. Zhang (author), G. Zhang (author), G. Zhng (author), G. Zhng (author), G. Qi Zhang (author), G. Qi Zhang (author), Guogi Zhang (author), Guogi Zhang (author), Guogi Zhng (author), Guogi Zhng (author), Guogi Qi Zhang (author), Guogi Qi Zhang (author), G.Q. Zhang (author), G.Q. Zhang (author), G.Q. Zhng (author), G.Q. Zhng (author), G.Q. Qi Zhang (author), G.Q. Qi Zhang (author), Guo-Qi Zhang (author), Guo-Qi Zhang (author), Guo-Qi Zhng (author), Guo-Qi Zhng (author), Guo-Qi Qi Zhang (author), Guo-Qi Qi Zhang (author), G. Q. Zhang (author), G. Q. Zhang (author), G. Q. Zhng (author), G. Q. Zhng (author), G. Q. Qi Zhang (author), G. Q. Qi Zhang (author), Guo Qi Zhang (author), Guo Qi Zhang (author), Guo Qi Zhng (author), Guo Qi Zhng (author), Guo Qi Qi Zhang (author), Guo Qi Qi Zhang (author), GQ Zhang (author), GQ Zhang (author), GQ Zhng (author), GQ Zhng (author), GQ Qi Zhang (author), GQ Qi Zhang (author), G.O. Zhang (author), G.O. Zhang (author), G.O. Zhng (author), G.O. Zhng (author), G.O. Qi Zhang (author), G.O. Qi Zhang (author), GuoQi Zhang (author), GuoQi Zhang (author), GuoQi Zhng (author), GuoQi Zhng (author), GuoQi Qi Zhang (author), GuoQi Qi Zhang (author)
To enhance the ability of lead-free solder joint to resistfailures induced by mechanical impact and shock, someresearchers have introduced low-Ag lead-free solder. In thisstudy, the formation and evolution of IMC, the fracturemorphology and performance of solder joint between SAC ...

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
Journal article (2008) - F Sun (author), P Hochstenbach (author), Williem van Driel (author), Williem Driel (author), Williem Van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), W. van Driel (author), W. Driel (author), W. Van Driel (author), W. D. van Driel (author), W. D. Driel (author), W. D. Van Driel (author), W.D. van van Driel (author), W.D. van Driel (author), W.D. van Van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), Willem D.Van van Driel (author), Willem D.Van Driel (author), Willem D.Van Van Driel (author), Willem D. van Driel (author), Willem D. Driel (author), Willem D. Van Driel (author), W.D. van Driel (author), W.D. Driel (author), W.D. Van Driel (author), Willem Dirk van van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Van Driel (author), Willem van Driel (author), Willem Driel (author), Willem Van Driel (author), WD van Driel (author), WD Driel (author), WD Van Driel (author), W. D. van van Driel (author), W. D. van Driel (author), W. D. van Van Driel (author), Guo Qi Zhang (author), Guo Qi Zhng (author), Guo Qi Qi Zhang (author), Guo Qi Z Zhang (author), Guo Qi Z Zhng (author), Guo Qi Z Qi Zhang (author), Kouchi Zhang (author), Kouchi Zhng (author), Kouchi Qi Zhang (author), Gouqi Zhang (author), Gouqi Zhng (author), Gouqi Qi Zhang (author), Guo Zhang (author), Guo Zhng (author), Guo Qi Zhang (author), Guoqi Zhang (author), Guoqi Zhng (author), Guoqi Qi Zhang (author), G.Q Zhang (author), G.Q Zhng (author), G.Q Qi Zhang (author), Guoqi Zhang (author), Guoqi Zhng (author), Guoqi Qi Zhang (author), G. Zhang (author), G. Zhng (author), G. Qi Zhang (author), Guogi Zhang (author), Guogi Zhng (author), Guogi Qi Zhang (author), G.Q. Zhang (author), G.Q. Zhng (author), G.Q. Qi Zhang (author), Guo-Qi Zhang (author), Guo-Qi Zhng (author), Guo-Qi Qi Zhang (author), G. Q. Zhang (author), G. Q. Zhng (author), G. Q. Qi Zhang (author), Guo Qi Zhang (author), Guo Qi Zhng (author), Guo Qi Qi Zhang (author), GQ Zhang (author), GQ Zhng (author), GQ Qi Zhang (author), G.O. Zhang (author), G.O. Zhng (author), G.O. Qi Zhang (author), GuoQi Zhang (author), GuoQi Zhng (author), GuoQi Qi Zhang (author)
In this study, the brittle fracture of intermetallic compound (IMC) between low-Ag SnAgCu (SAC) solder and under bump metallization (UBM) under high-speed pull condition is studied for wafer-level chip-scale packages (WLCSP). The fracture morphology and fracture mechanism of IMC ...