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JH
J Hui
Academic Work (1)
Conference paper (1)
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Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages
Conference paper (2005) -
YT He (author)
,
F Li (author)
,
WF He (author)
,
J Hui (author)
,
GQ Zhang (author)
,
L.J. Ernst (author)
