Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

Conference paper (2005)

Authors

YT He External organisation
F Li External organisation
WF He External organisation
J Hui External organisation
GQ Zhang External organisation
L.J. Ernst Dynamics of Micro and Nano Systems
Research Group
Dynamics of Micro and Nano Systems
More Info
expand_more

Published Date

2005

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Dynamics of Micro and Nano Systems

No files available

Metadata only record. There are no files for this conference paper.