31-34 HGz low noise amplifier with on-chip microstrip lines and inter-stage matching in 90 nm baseline CMOS

Semi-analytical stability analysis of doubly-curved orthotropic shallow panels - considering the effects of boundary conditions

Finite element modeling of solder interconnection reliability with variable solder geometry

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

Virtual thermo-mechanical prototyping of microelectronics: the challenges for mechanics professionals

Virtual thermo-mechanical prototyping of electronic packaging - challenges in material characterization and modeling

Creep behavior of a molding compound and its effect on packaging process stresses

Innovative thermo-mechanical design and qualification of microelectronics - the challenges for mechanical professionals

Thermally induced delamination-buckling in a copper-ceramic microelectronic product

Packaging induced die stresses considering time-dependent behaviour of a molding compound

Buckling driven interface delamination between a thin metal layer and a ceramic substrate

Response surface modeling for non-linear packaging stresses

Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound

Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

Virtual thremo-mechanical prototyping of electronic packaging using Philips optimization strategy

Packaging polymer's curing process characterisation and modelling