GZ

G.Q. Zhang

16 records found

Authored

31-34 HGz low noise amplifier with on-chip microstrip lines and inter-stage matching in 90 nm baseline CMOS
Conference paper (2006) - M.A.T. Sanduleanu, G.Q. Zhang, J..R.. Long

Semi-analytical stability analysis of doubly-curved orthotropic shallow panels - considering the effects of boundary conditions
Journal article (2002) - D.H. van Campen, V.P. Bouwman, G.Q. Zhang

Buckling driven interface delamination between a thin metal layer and a ceramic substrate
Conference paper (2001) - CJ Liu, G.Q. Zhang, L.J. Ernst, M Vervoort, G. Wisse

Virtual thermo-mechanical prototyping of electronic packaging - challenges in material characterization and modeling
Conference paper (2001) - G.Q. Zhang, AAO Tay, L.J. Ernst, et. al.

Packaging induced die stresses considering time-dependent behaviour of a molding compound
Conference paper (2001) - JHJ Janssen, G.Q. Zhang, L.J. Ernst, MS Kiasat, et. al.

Thermally induced delamination-buckling in a copper-ceramic microelectronic product
Conference paper (2001) - CJ Liu, G.Q. Zhang, L.J. Ernst, G. Wisse

Finite element modeling of solder interconnection reliability with variable solder geometry
Conference paper (2001) - XJ Zhao, G.Q. Zhang, JFJ Caers, L.J. Ernst

Virtual thermo-mechanical prototyping of microelectronics: the challenges for mechanics professionals
Conference paper (2001) - G.Q. Zhang, P Maessen, L.J. Ernst, et. al.

Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound
Conference paper (2001) - MS Kiasat, L.J. Ernst, G.Q. Zhang, et. al.

Innovative thermo-mechanical design and qualification of microelectronics - the challenges for mechanical professionals
Conference paper (2001) - G.Q. Zhang, P Maessen, J Bisschop, L.J. Ernst

Response surface modeling for non-linear packaging stresses

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties
Conference paper (2001) - DG Yang, G.Q. Zhang, L.J. Ernst, et. al.

Creep behavior of a molding compound and its effect on packaging process stresses
Conference paper (2001) - MS Kiasat, G.Q. Zhang, L.J. Ernst, G. Wisse

Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling
Conference paper (2000) - G.Q. Zhang, AAO Tay, L.J. Ernst

Virtual thremo-mechanical prototyping of electronic packaging using Philips optimization strategy
Conference paper (2000) - J Janssen, G.Q. Zhang, L.J. Ernst, et. al.

Packaging polymer's curing process characterisation and modelling