Creep behavior of a molding compound and its effect on packaging process stresses

Conference paper (2001)

Authors

MS Kiasat Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
G.Q. Zhang External organisation
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
G. Wisse Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
More Info
expand_more

Published Date

2001

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems