Mv
M van Soestbergen
6 records found
1
Board level reliability can be of high interest for automotive electronic components when exposed to vibration-prone environments. However, the absence of an industry standard for board level vibration testing poses several challenges in establishing a well-characterized test set
...
Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above),
...
Board level vibration test method of components for automotive electronics
State-of-the-art approaches and challenges
Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to false board level reliability (BLR
...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers, i
...
The risk of corrosion poses a challenge to meet the stringent reliability requirements of microelectronic devices that are used in harsh environments. Microelectronic devices are often encapsulated in polymer packaging materials, which protect them from corrosion. These polymers
...
The reliability of LEDs decreases in moist environments. One potential gateway of moisture ingress, reducing the product lifetime is the lens. In white LEDs, phosphor particles are embedded into the optical silicone of the lens to convert the blue light emitted by the diode down
...