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L Luo

Journal article (4)

4 records found

1

Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Journal article (2015) - Y. Liu (author) , F Sun (author) , L Luo (author) , CA Yuan (author) , Guo Qi Zhang (author)

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal article (2014) - Y. Liu (author) , SYY Leung (author) , J Zhao (author) , CKY Wong (author) , CA Yuan (author) , Guo Qi Z Zhang (author) , F Sun (author) , L Luo (author)

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Journal article (2014) - Y. Liu (author) , J.C. Meerwijk (author) , L Luo (author) , Hang Zhang (author) , F Sun (author) , CA Yuan (author) , Guo Qi Zhang (author)

Effect of corrosion inhibitors on cement paste pore structure

Journal article (2007) - L Luo (author) , G. (Guang) Ye (author) , G De Schutter (author)