L Luo | TU Delft Repository

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L Luo

Journal article (4)

4 records found

1

Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Journal article (2015) - Y. Liu (author), F Sun (author), L Luo (author), C.A. Yuan (author), Kouchi Zhang (author)

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal article (2014) - Y. Liu (author), SYY Leung (author), J. Zhao (author), K.Y. Wong (author), C.A. Yuan (author), Kouchi Zhang (author), F Sun (author), L Luo (author)

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Journal article (2014) - Y. Liu (author), J.C. Meerwijk (author), L Luo (author), H. Zhang (author), F Sun (author), C.A. Yuan (author), Kouchi Zhang (author)

Effect of corrosion inhibitors on cement paste pore structure

Journal article (2007) - L Luo (author), G. (Guang) Ye (author), G De Schutter (author)