Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Liu, Y.; Sun, F; Luo, L; Yuan, C.A.; Zhang, Kouchi

Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

Journal article (2015)

Authors

Y. Liu Electronic Components, Technology and Materials -

F Sun External organisation

L Luo External organisation

C.A. Yuan Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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http://resolver.tudelft.nl/uuid:98216754-a54e-46a7-8abc-ce747eb76216

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Published Date

2015

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials