Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Liu, Y.; Meerwijk, J.C.; Luo, L; Zhang, Hang; Sun, F; Yuan, CA; Zhang, Guo Qi

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Journal article (2014)

Authors

Y. Liu External organisation

J.C. Meerwijk Electronic Components, Technology and Materials

L Luo External organisation

Hang Zhang External organisation

F Sun External organisation

CA Yuan Electronic Components, Technology and Materials

Guo Qi Zhang Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2014

Language

English

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Research Group

Electronic Components, Technology and Materials

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