Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

Conference paper (2006)

Authors

X. Ma Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

One type of polymer EPN1180 is slected for the hygroscopic swelling tests and the sample is made in the thickness of 30 mumeter. Coefficient of thermal expansion is tested by using DMA Q800 and coefficient of moisture expansion is tested by using DMA Q800 jointed with a humidity generator. Three conditions temperature, 50 degrees C, 60 degrees C and 70 degrees C, and different relative humidity with 20RH% steps are used for the tests and moisture induced expansion is characterized. The characterized equation can be used to expect the moisture-induced expansion at temperature between 0 degrees C and 100 degrees C, at relative humidity between 0RH% and 100RH% for this epoxy. This new method is convenient than that of the old method and easily is used to characterize other polymers. In addition hygroscopic effect on the viscoelasticity is tested and characterized. The storage modulus is linear decreased with the increase of relative humidity at certain temperature.