Warpage deformation analysis of AMB ceramic substrates in power modules

Conference paper (2024)

Authors

D. Hu Electronic Components, Technology and Materials -

Chieh Wang Student

Z. Li Electronic Components, Technology and Materials -

N. Gupta Electronic Components, Technology and Materials -

René H. Poelma Electronic Components, Technology and Materials - , Nexperia B.V.

Ziliang Shi Nexperia B.V.

J. Fan Research Institute of Fudan University, Ningbo, Electronic Components, Technology and Materials - , Shanghai Engineering Technology Research Center for SiC Power Device

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Finite element analysis Ceramics Annealing Analytical models Three-dimensional displays Solid modeling Multichip modules

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Published Date

2024

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of the warpage, validation of the proposed model, and optimization for effective warpage management. At first, the coefficient of thermal expansion (CTE) and yield strength of the copper (Cu) layer in AMB were characterized and adopted in a two-dimensional (2D) finite element model. The evolution of simulated strain and moments revealed the cause of the warpage during the manufacturing processes. Furthermore, the 2D model was extended to a three-dimensional (3D) model. The finite element method (FEM) and experiments were conducted on different heat treatment conditions for 3D model validation. The validated 3D model was applied to carry out a design of experiments (DoEs) for design optimization to reduce the warpage. Consequently, the factor analysis in DoEs was demonstrated by different pattern designs using subtractive milling techniques.

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- Embargo expired in 09-10-2024