Low temperature deposition of TiN by plasma-assisted atomic layer deposition for system-in-package applications

Conference paper (2005)

Authors

SBS Heil External organisation
E Langereis External organisation
F Roozeboom External organisation
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
MCM van de Sanden External organisation
WMM Kessels External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2005

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials