Parameter sensitivity study of cure-dependent underfill properties on flip chip failures

Yang, D; Zhang, GQ; van Driel, W; Janssen, J.; Bressers, HJL; Ernst, LJ

Parameter sensitivity study of cure-dependent underfill properties on flip chip failures

Conference paper (2002)

Authors

D Yang Dynamics of Micro and Nano Systems

GQ Zhang External organisation

W van Driel External organisation

J. Janssen External organisation

HJL Bressers External organisation

LJ Ernst Dynamics of Micro and Nano Systems

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2002

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Research Group

Dynamics of Micro and Nano Systems

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