On Wire Failures in Microelectronic Packages

Journal article (2009)

Authors

Williem van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
RBR van Silfhout External organisation
Guo Qi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

Abstract: At present, over 95% of the manufactured packages are still being wire-bonded. due to the ongoing trend of miniaturization, material changes, and cost reduction, wire-bond-related failures are becoming increasingly important. Different finite-element (FE) techniques are explored for their ability to describe the thermomechanical behavior of the wire embedded in the electronic package. The developed nonlinear and parametric FE models are able to predict the strong nonlinear behavior of wire failures and multifailure-mode interaction accurately and efficiently. It is found that both processing and reliability-testing environments as well as the occurrence of delamination strongly increase the risk of wire failures. Our results indicate that processing and reliability-testing influences are much less than those of the delamination. Combining the strengths of predictive modeling with simulation-based optimization methods, the optimal wire-loop shape is obtained.

Index Terms: Delamination, finite-element (FE) modeling, wire-bond reliability, wire-loop shape.