Verification of Drop Impact Simulations Using High-Speed Camera Measurements

Conference paper (2008)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
FJHG Kessels External organisation
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

The increased use of mobile appliances in today's society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.