Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide

Conference paper (2009)

Authors

V. Rajaraman Electronic Instrumentation - EEMCS
L.S. Pakula Electronic Instrumentation - EEMCS
HTM Pham Old - EWI Sect. ECTM
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
P.J. French Electronic Instrumentation - EEMCS
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation