Through-wafer electrical vias for RF silicon technology

Wang, Z; Wang, L; Schellevis, H.; Wien, W.H.A.; Burghartz, JN; Sarro, Pasqualina M.

Through-wafer electrical vias for RF silicon technology

Conference paper (2003)

Authors

Z Wang Old - EWI Ch. Integrated Sensing Devices

L Wang Electronic Components, Technology and Materials -

H. Schellevis Electronic Components, Technology and Materials -

W.H.A. Wien Electronic Components, Technology and Materials -

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Pasqualina M. Sarro Electronic Components, Technology and Materials -

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2003

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Research Group

Old - EWI Ch. Integrated Sensing Devices