A study on the creep damage of epoxy molding compound in IC package

Conference paper (2003)

Authors

S. Liu External organisation
L. Qin External organisation
D Yang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2003

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems