System in package (SiP) technology

Fundamentals, design and applications

Journal article (2018)

Authors

F. Santagata Guangdong Dongguan Quality Supervision Testing Center
J. Sun Electronic Components, Technology and Materials - EEMCS
E. Iervolino Southern University of Science and Technology
H. Yu Southern University of Science and Technology
F. Wang Southern University of Science and Technology
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2018 F. Santagata, J. Sun, E. Iervolino, H. Yu, F. Wang, Kouchi Zhang, Pasqualina M Sarro, Guoyi Zhang
DOI: https://doi.org/10.1108/MI-09-2017-0045
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Published Date

2018

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design/methodology/approach: The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing. Findings: In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system. Originality/value: SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

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