Micro-hotplate and Micro-hotplate integrated Nano-reactors are a revolution for in-situ observations in Transmission Electron Microscopy (TEM) imaging. They currently operate at about 400oC without any problems. The SiNx membranes of micro-hotplate and Nano-reactors have integrat
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Micro-hotplate and Micro-hotplate integrated Nano-reactors are a revolution for in-situ observations in Transmission Electron Microscopy (TEM) imaging. They currently operate at about 400oC without any problems. The SiNx membranes of micro-hotplate and Nano-reactors have integrated micro-heater along with electron transparent windows. The major problem is the shift in 'z' direction of the membranes as a function of pressure and temperature. This creates a change in focus during in-situ TEM imaging affecting the image quality. Net compressive forces can be a reason for bending of membranes, as far as temperature is concerned. Thus, introduction of residual tensile stress was considered to solve this problem. Simple COMSOL simulations were made using plate models to verify the effect of residual tensile stress in membranes as a function of temperature and pressure individually, as well as a combination of both. It was concluded that residual tensile stress does reduce thermal buckling. It also reduces the bulging due to pressure but bulging as a function of pressure can't be made zero. It also concludes thermal buckling is more dominant at lower pressure and pressure bulge is more dominant at higher pressure.
Different residual stress LPCVD SiNx films were deposited and material properties like Young's modulus, refractive index and density were characterized. A saturation to the deposition and residual tensile stress was found as a function of gas-ratio. Surface morphology and IR spectra were also determined using AFM and FTIR respectively. All the characterization done proves the change in material composition with fabrication parameters. The introduction of high residual stress questions the reliability of the membrane and hence, there was a need to check if high tensile residual stress doesn't break the membranes. Thus, a new device for wafer level pressure testing of membranes was designed and fabricated. The pressure bulge test was done and reflections were recorded for various pressure and stress levels. The membranes were found reliable up to a pressure of 1.5 bar. New generation of micro-hotplates were fabricated using this concept and an increment 400oC in the operating temperature of micro-hotplates and nano-reactors, without any-shift in 'z' direction due to temperature, was achieved.