AN Chiaramonti | TU Delft Repository

AC

AN Chiaramonti

Conference paper (2)

Journal article (3)

5 records found

1

Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Journal article (2014) - AN Chiaramonti (author), S. Vollebregt (author), AW Sanders (author), R. Ishihara (author), DT Read (author)

Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature

Journal article (2014) - S. Vollebregt (author), S Banerjee (author), AN Chiaramonti (author), F.D. Tichelaar (author), C.I.M. Beenakker (author), R. Ishihara (author)

Towards the integration of carbon nanotubes as vias in monolithic three-dimensional integrated circuits

Journal article (2013) - S. Vollebregt (author), AN Chiaramonti (author), J. van der Cingel (author), C.I.M. Beenakker (author), R. Ishihara (author)

Contact resistance of low-temperature carbon nanotube vertical interconnects

Conference paper (2012) - S. Vollebregt (author), AN Chiaramonti (author), R. Ishihara (author), H. Schellevis (author), C.I.M. Beenakker (author)

Integrating carbon nanotubes as vias in a monolithic 3DIC process

Conference paper (2012) - S. Vollebregt (author), R. Ishihara (author), AN Chiaramonti (author), J. van der Cingel (author), C.I.M. Beenakker (author)