Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature

Towards the integration of carbon nanotubes as vias in monolithic three-dimensional integrated circuits

Contact resistance of low-temperature carbon nanotube vertical interconnects

Integrating carbon nanotubes as vias in a monolithic 3DIC process