AN Chiaramonti | TU Delft Repository

AC

AN Chiaramonti

Conference paper (2)

Journal article (3)

5 records found

1

Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Journal article (2014) - AN Chiaramonti (author), S. Vollebregt (author), Sten Vollebregt (author), AW Sanders (author), R. Ishihara (author), DT Read (author)

Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature

Journal article (2014) - Sten Vollebregt (author), S. Vollebregt (author), S. Banerjee (author), AN Chiaramonti (author), F.D. Tichelaar (author), F. D. Tichelaar (author), C.I.M. Beenakker (author), R. Ishihara (author)

Towards the integration of carbon nanotubes as vias in monolithic three-dimensional integrated circuits

Journal article (2013) - S. Vollebregt (author), Sten Vollebregt (author), AN Chiaramonti (author), J. van der Cingel (author), C.I.M. Beenakker (author), R. Ishihara (author)

Integrating carbon nanotubes as vias in a monolithic 3DIC process

Conference paper (2012) - S. Vollebregt (author), Sten Vollebregt (author), R. Ishihara (author), AN Chiaramonti (author), J. van der Cingel (author), C.I.M. Beenakker (author)

Contact resistance of low-temperature carbon nanotube vertical interconnects

Conference paper (2012) - S. Vollebregt (author), Sten Vollebregt (author), AN Chiaramonti (author), R. Ishihara (author), H. Schellevis (author), C.I.M. Beenakker (author)