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F Santagata
Academic Work (1)
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3D system-in-package design using stacked silicon submount technology
Journal article (2015) -
Mingzhi Dong (author)
,
F Santagata (author)
,
R. Sokolovskij (author)
,
J Wei (author)
,
C Yuan (author)
,
Guo Qi Zhang (author)