3D system-in-package design using stacked silicon submount technology

Dong, Mingzhi; Santagata, F; Sokolovskij, R.; Wei, J; Yuan, C; Zhang, Guo Qi

3D system-in-package design using stacked silicon submount technology

Journal article (2015)

Authors

Mingzhi Dong Electronic Components, Technology and Materials

F Santagata External organisation

R. Sokolovskij Electronic Components, Technology and Materials

J Wei Electronic Components, Technology and Materials

C Yuan External organisation

Guo Qi Zhang Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2015

Language

English

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Research Group

Electronic Components, Technology and Materials

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