Metal-oxide-semiconductor field-effect transistors (MOSFETs) undergo fatigue degradation under high thermal and electrical stresses. This process results in changes in their parasitic parameters, which can be detected using frequency domain reflectometry (FDR). Frequency domain impedance analysis is employed to characterize the various quality states of Si and SiC MOSFETs obtained from accelerated aging experiments. Results demonstrate a consistent increase in parasitic resistance as the devices degrade. By determining the drain-source parasitic resistance at the self-resonant frequency (f_ SRF) and the drain-source on-resistance for MOSFETs with varying degradation degrees, positive linear numerical fitting equations (14)-(15) are established to predict MOSFET degradation under zero DC bias voltage. In addition, FDR technology is used to identify the drain parasitic resistance at the f_ SRF of MOSFET samples with different sizes of defects in the sintered silver layer. These results reveal a positive correlation between the quality of the sintered silver layer and Rrm DSRF. The proposed approach is an effective quality screening technology for power semiconductor devices without requiring power-on treatment.

@en

With the emerging wide bandgap (WBG) semiconductor development, the increasing power density and efficiency of power electronic converters may cause more switching oscillation, electromagnetic interference noise, and additional power loss, further increasing the probability of device failure. Therefore, determining and quantifying the failure of a metal-oxide-semiconductor-field-effect transistor (MOSFET), which assembled using WBG semiconductor in some applications, is crucial to improving the reliability of a power converter. This study proposes a novel failure quantitative assessment approach based on MOSFET parasitic parameters. According to the two-port network theory, MOSFET is equivalent to some second-order RLC circuits composed of independent inductances, capacitances, and resistances in series. Then, the frequency-domain impedance associated with the physical failure of MOSFET is identified through frequency domain reflectometry. Accelerated aging and bond wires cut-off experiments are employed to obtain various quality states of the MOSFET device. Result shows that the MOSFET quality level and its number of bond wire lift-offs can be quantified effectively. Drain-to-source on-resistance (R_DS(on)) that normally represents the MOSFET quality shows a positive linear function relationship on drain-to-source parasitic resistance (R_D + R_S) during the quality degradation proceeding. This finding matches with the correlation established between R_{DS (on)} and R_D + R_S in theory. Meanwhile, source parasitic inductance (L_S) increases with the severity of bond wires faults, and even the slight fault shows a high sensitivity. The proposed approach would be an effective quality screening technology for power semiconductor devices without power on treatment, which can effectively avoid the impact of junction temperature and test conditions (current and voltage) on test results, and does not need to design additional test circuits. The test frequency range we used in this approach was 10–300 MHz, which to some extent is suitable for providing an on-line quality monitoring technology for high-frequency WBG power devices manufacturing.

@en

UVC-LED is known as a deep ultraviolet LED. The application development and disinfection efficiency of UVC-LED modules are important problems encountered when UVC-LED products are rushed into commercialization. In this article, a specific disinfection experiment with a UVC-LED module was combined to analyze the disinfection efficiency. UVC-LEDs with wavelengths of 260 and 280 nm were used and supplemented with UVA-LEDs with wavelengths of 360 and 390 nm. The module was packaged to investigate the inactivation of Escherichia coli and Staphylococcus aureus. Two new findings were obtained through the analysis and comparison of the experiments. First, the short wavelength from UVA might have an enhanced destructive effect on microorganisms when the radiation intensity of UVA-LED was sufficient with coupling UVA and UVC. Second, 260 nm UVC-LED lamp beads might have a shorter response time to inactivate microorganisms than 280 nm UVC-LED lamp beads. Bactericidal experiments near the surface and different radiation distances showed that the inactivation rate reached 99.9% after 1 min of exposure when the UVC-LED module was set at 260 or 280 nm wavelength lamp beads for disinfection. The disinfection efficiency of 280 nm UVC-LED lamp beads was higher than that of 260 nm UVC-LED lamp beads because of the increased UV intensity. The radiation distance was within 7.5 cm range, the exposure time was 60 s, the inactivation rate was over 99.9%, and the disinfection effect was remarkable. For current UVC-LED applications, such as near-surface UVC-LED, disinfection and air purification products have a high value.@en

Bond wire damage is one of the most common failure modes of metal-oxide semiconductor field-effect transistor (MOSFET) power devices in wire-welded packaging. This paper proposes a novel bond wire damage detection approach based on two-port network measurement by identifying the MOSFET source parasitic inductance (LS). Numerical calculation shows that the number of bond wire liftoffs will change the LS, which can be used as an effective bond wire damage precursor. Considering a power MOSFET as a two-port network, LS is accurately extracted from frequency domain impedance (Z−parameter) using a vector network analyzer under zero biasing conditions. Bond wire cutoff experiments are employed to validate the proposed approach for bond wire damage detection. The result shows that LS increases with the rising severity of bond wire faults, and even the slight fault shows a high sensitivity, which can be effectively used to quantify the number of bond wire liftoffs of discrete MOSFETs. Meanwhile, the source parasitic resistance (RS) extracted from the proposed two-port network measurement can be used for the bond wire damage detection of high switching frequency silicon carbide MOSFETs. This approach offers an effective quality screening technology for discrete MOSFETs without power on treatment.

@en

With the rapid development of lighting technology and auto industry, it has been an important research subject for many motor manufacturers to improve headlight performance. LED light has achieved a dominant position in lighting technology because of the advantages, such as the small size, low energy consumption, and long service life. In a complex working environment, the reliability of light source module is an indispensable parameter for a LED headlight, which can lead to poor energy efficiency, decreased light intensity, and a shorter service life with low reliability. In the working process of headlights, the rising LED temperature will reduce the luminous flux and thermostability, even affect normal operation. Therefore, understanding and evaluating the relevant factors affecting LED reliability is an important measure to ensure the stabilizations of LED headlights. In this paper, the finite element software and optical simulation software are used to simulate the temperature field, flow field, and optics of the LED headlight module. Firstly, in order to understand the influence of temperature on the stability of the headlight, the temperature field and flow field distribution of the headlight are studied by finite element software. Secondly, we use the optical simulation software to study the optical parameters of headlight at different temperatures. It shows that the highest temperature appears in the LED chip, and the lowest temperature appears in the maximum end face of the headlight shell. For the same power LED, the higher working temperature leads to higher LED junction temperature. Affected by the working environment temperature, the luminous flux of the headlight will decrease with the increase of temperature.@en

Silicon carbide (SiC) is a third-generation semiconductor material with many advantages, such as high thermal conductivity, high critical breakdown voltage, and high saturated electron drift velocity, which can increase the operating frequency of the power conversion system to more than 100kHz. In the high-frequency, the parasitic effect will significantly reduce the switching speed of the power devices, increase power consumption and influence the uniformity of current distribution. In this paper, we established the calculation nodes of each part of the SiC-MOSFET Half-bridge power module and used ANSYS Q3D software to extract the parasitic parameters. Die-Die, Die-DBC-1, Die-DBC-2 and hybrid interconnect package structures were designed to optimize the parasitic inductance. Simulation results indicated that the chip-DBC-1 structure can reduce the parasitic inductance about 30% compared with Chip-Chip structure and effectively control the uniformity of current density on two parallel diode chips (ΔLdiode <0.1%). In the meantime, an 3D model of partial bond wires broken were designed to get further insight into the variation of parasitic inductances. The correlation mechanism between the partial bond wires broken and inductance change of the D-S terminals current path was studied. The results showed that as the number of broken bond wires increases, the inductance of D-S terminals current path was increased gradually. Finally, by using two-port S-parameters measurement method to extract the inductances of the discrete power device, the experimental results indicated that when one or two bond wires were broken, the inductance of D-S terminals current path increased by 4.69% and 15.69%, respectively. Overview, a risk evaluation method for SiC power devices based on the variation of the parasitic parameters of the bond wire was established.@en

For light-emitting diode (LED) package, interface delamination is a key factor that triggers reliability issues. When the delamination occurs in the thermal path of the die attach (DA) layer, the heat transfer capacity will be blocked and the junction temperature of the device will increase, which will affect various other failure mechanisms and ultimately reduces the life of the LED package. In this paper, the finite element method is used and based on entropy generation analysis. Interfacial delamination is prefabricated to the upper and lower interfaces of a model. The effects of cracks simultaneously appearing at different positions and lengths of the upper and lower interfaces on heat transfer are compared. Based on the simultaneous results, in the same position of the DA layer, the entropy generation value of delamination is larger than that without delamination, and the entropy generation value of delamination in the same position of the upper and lower interfaces is greater than that of not located in the same position. The larger the entropy generation value, the worse the heat transfer performance. And cracks appearing at the edge of the upper and lower interfaces have greater damage on heat conduction than the middle position. In addition, as the delamination length simultaneously increases at the upper and lower interfaces, the heat transfer performance becomes worse.@en

Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

@en

Using first-principles calculation, we have studied the adsorption effect of small gas molecules (H₂O, CO₂, CH₄, SO₂, H₂S, and NH₃) on GeP₃ monolayer. To determine the most stable adsorption site, five adsorption sites (center, Ge, P, bridge GeP, and bridge PP) were considered in the paper. Through calculations of adsorption energy, adsorption distance, and charge transfer, we preliminarily determined that H₂O, CO₂, and CH₄ were physically adsorbed on GeP₃ via weak van der Waals force. However, SO₂, H₂S, and NH₃ were chemically adsorbed on GeP₃ with new covalent bonds formed, as concluded by calculations of electron localization function and charge density difference. Gas molecule adsorption can cause significant changes in the band gap of single-layer GeP₃, indicating that pristine GeP₃ monolayer is sensitive to these gases. In addition, the adsorption energy of the H₂O, CO₂, and CH₄ adsorbed on GeP₃ can be tuned effectively by employing an external electric field. Our theoretical studies reveal that GeP₃ monolayer is a promising gas-sensitive material used in nanometer devices.                                                                                                    

@en

A novel silicone rubber elastic key (SREK) is proposed in this paper for surface mounting technology (SMT) applications. Effects of thermal reflowing stress on the mechanical properties of SMT-SREKs are investigated. The manufactured SMT-SREKs, which underwent various reflowing conditions in advance, are subjected to pressing force and fatigue pressing tests. Fatigue lifetime projection model and its predicted error are then assessed systematically. The thermal degradation of silicone rubber materials is illustrated through the dynamic mechanical analysis and the Fourier transform infrared spectroscopy experiments. The mechanical finite element modeling is also conducted to simulate the pressing process. The results show that the pressing force and tactility of the SMT-SREKs are strongly affected by the reflowing condition, which contributes to the degradation of the silicone rubber materials. During the fatigue pressing test, the change rate of tactility increases with the reflowing peak temperature ( T-{p} ) and is accelerated by the repeated reflowing process. Moreover, a linear model can precisely project the tactility before the fatigue pressing number of 2.0E+6 times, and the impact rate of T-{p} on tactility with the increasing fatigue pressing number can be predicted effectively by using a logarithm model.

@en

The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has the largest adsorption energy on methane, while the armchair graphene with Order stacking is opposite. In addition, both the Order and Bernal stacked graphenes possess a positive linear relationship between adsorption energy and layer number. Furthermore, they always have larger adsorption energy in zigzag graphene. For electronic properties, the results show that the stacking effects on band gap are significant, but it does not cause big changes to band structure and density of states. In the comparison of distance, the average interlamellar spacing of the Order stacked graphene is the largest. Moreover, the adsorption effect is the result of the interactions between graphene and methane combined with the change of graphene’s structure. Lastly, the armchair graphene with Order stacking possesses the lowest formation energy in these five dopants. It could be the best choice for doping to improve the methane adsorption.

@en

A novel terahertz modulator based on graphene is proposed and designed. The device consists of a silicon ridge covered by a graphene sheet. The transmission properties of the proposed structure demonstrate that the introduction of graphene can improve the switching and filtering performance of modulators, and enhance its field confinement capability. In the case of the number of layers, a blue shift can be observed in the center wavelength with increase of graphene layers. Meanwhile, the relationship between the number of layers and the peak of reflection spectra is an inverse proportion function. In addition, we find that the center wavelength is almost unchanged with respect to the different chemical potential, thus the effective refractive indices of the cross section of light propagation direction can be well preserved. These findings will contribute to the research and development of graphene based THz waveguide modulators.

@en

The color coordinate shift of light-emitting diode (LED) lamps is investigated by running three stress-loaded testing methods, namely step-up stress accelerated degradation testing, step-down stress accelerated degradation testing, and constant stress accelerated degradation testing. A power model is proposed as the statistical model of the color shift (CS) process of LED products. Consequently, a CS mechanism constant is obtained for detecting the consistency of CS mechanisms among various stress-loaded conditions. A statistical procedure with the proposed power model is then derived for the CS paths of LED lamps in step-loaded stress testing. Two types of commercial LED lamps with different capabilities of heat dissipation (CHDs) are investigated. Results show that the color coordinates of lamps are easily modified in various stress-loaded conditions, and different CHDs of lamps may play a crucial role in the various CS processes. Furthermore, the proposed statistic power model is adequate for the CS process of LED lamps. The consistency of CS mechanisms in step-loaded stress testing can also be detected effectively by applying the proposed statistic procedure with the power model. Moreover, the constant assumption in the model is useful for judging the consistency of CS mechanisms under various stress-loaded conditions.

@en