Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging

Wang, L; Sarro, Pasqualina M; Burghartz, JN; Wang, Z.

Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging

Journal article (2006)

Authors

L Wang Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Z. Wang External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2006

Language

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials