Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

Xiao, A.; de Vreugd, J; Pape, H; Wunderle, B; Jansen, Kaspar M.B.; Ernst, LJ

Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

Conference paper (2009)

Authors

A. Xiao Computational Design and Mechanics

J de Vreugd Computational Design and Mechanics

H Pape External organisation

B Wunderle External organisation

Kaspar M.B. Jansen Computational Design and Mechanics

LJ Ernst Computational Design and Mechanics

Research Group

Computational Design and Mechanics

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Published Date

2009

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Research Group

Computational Design and Mechanics

Abstract

An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.

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