Integrated silicon-polymer laterally stacked bender for sensing microgrippers

Conference paper (2006)

Authors

T Chu Duc Electronic Components, Technology and Materials -

J. Wei Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

GK Lau Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2006

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This paper presents a novel electro-thermal microgripper based on integrated silicon-polymer laterally stacked microactuators. The device consists of a serpentine-shape deep silicon structure with a thin film aluminum heater on the top and filling polymer in the trenches among the vertical silicon parts. The fabrication is based on deep reactive ion etching of silicon, aluminum sputtering and SU8 filling. The actuator is 500 µm long, 65 µm wide and 50 µm high. The microgripper generates a large motion up to 52 µm at a driving voltage of only 2 V and with a power consumption of 50 mW. The maximum working temperature is 164 degrees Centigrade at 2 V.