Passivation Cracking Analyses of Micro-structures of IC Packages

Journal article (2006)

Authors

Y He Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
H. Li External organisation
R Shi External organisation
F Li External organisation
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

The passivation cracking of Micro-structures of IC packages is studied by maximum principal stress theory using a certain 2D FEM model with different design parameters, pitch of lines, width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue material's yielding stress and Aluminium yielding stress (following as "d", "w", "t_epo", "t_Teos", "t_glue", "sy_glue"and "sy_al" respectively). For different critical process steps, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of principal stress is established using any two design parameters. Results show that "d", "w", "t_epo", "sy_glue" and "sy_al" will have great influence on passivation cracking while "t_Teos" have a little impact.