Influence of the passivation material on Stress voiding in AI-Cu alloys.

Journal article (2000)

Authors

JP Lokker QN/Fysics of NanoElectronics
G.C.A.M. Janssen OLD Metals Processing, Microstructures and Properties
S Radelaar OLD Metals Processing, Microstructures and Properties
Research Group
QN/Fysics of NanoElectronics
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Published Date

2000

Language

Undefined/Unknown

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Research Group

QN/Fysics of NanoElectronics