Vertical die crack stresses of Flip Chip induced in major package assembly processes

Yang, DG; Ernst, L.J.; van t Hof, C; Kiasat, MS; al., et.

Vertical die crack stresses of Flip Chip induced in major package assembly processes

Journal article (2000)

Authors

DG Yang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

C van t Hof Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

MS Kiasat Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

et. al. External organisation

Research Group

Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)

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Published Date

2000

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems